Copper Gleam™ HV-101 & HV-606 Electrolytic Copper_深圳市同泰化學技術有限公司 電鍍中間體/水性樹脂與助劑/特種水性油墨/水性納米二氧化矽/工業清洗/半導體化學品

Copper Gleam™ HV-101 & HV-606 Electrolytic Copper

2025-12-13 09:44

Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.

 

The Copper Gleam™ HV-606 bath has been developed to work with insoluble anodes to deliver high plating performance at high current densities.

 

Key Benefits:

  • Excellent throwing power on through-holes and microvias
  • Exceptional panel plating distribution
  • Exceptional leveling performance on panel surface and inside through holes
  • Round plated shape on via bottom

Excellent Throwing Power

Exceptional levelling

Ideal Microvia
Bottom Shape

 

 

copper-gleam-hv101

 

 

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