Copper Gleam™ HS-200 Electrolytic Copper from Dupont Dow Rhom Hass Company_深圳市同泰化學技術有限公司 電鍍中間體/水性樹脂與助劑/特種水性油墨/水性納米二氧化矽/工業清洗/半導體化學品

Copper Gleam™ HS-200 Electrolytic Copper from Dupont Dow Rhom Hass Company

2025-12-13 10:08

The Copper Gleam™ HS-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. Formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.
 

Key Benefits:

  • Bright uniform deposits
  • Exceptional physical properties
  • Complete analytical control
     

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