Microfill™ LVF 3 Acid Copper from Dupont Dow Rhom Hass Company

Microfill™ LVF 3 Acid Copper is designed to offer exceptional blind microvia filling performance, and is specifically formulated for use with insoluble anodes and direct current (DC) rectification. Formulated to operate over a broad range of operating conditions, the bath offers end users with outstanding production flexibility in either panel or pattern plate operation.
 

Advantages:

• Excellent blind microvia fill with lower copper surface thickness
• Bright, highly ductile, leveled deposit
• DC process with insoluble anodes for simple operation
• Easily analyzed and controlled by conventional CVS
• Designed for use in both pattern and panel plate applications
• Tunable process for specific end user requirements
   

Download Presentation   English only 
Read Technical Article   English only
 

Read Technology for Through Hole Filling 
Microfill™ THF Electrolytic Copper
 

Dielectric thickness: 110 µm
Plating thickness: 12 µm

 

酸性鍍銅中(zhong)間體相關鏈接：

垂(chuí)直連續電鍍（VCP）高TP值(zhí)酸性鍍銅光澤劑(jì)用電鍍中間體： benxiaohai.cc/news/170.html
 

PCB/FPC用(yong)高TP值VCP酸性鍍銅光(guāng)亮劑中間體産品(pǐn)介紹： benxiaohai.cc/news/30.html
 

2021年度填孔鍍(dù)銅——印刷線路闆（PCB，FPC）酸(suan)性填孔鍍銅中間(jian)體： benxiaohai.cc/news/283.html

 

2021年國際表面處(chù)理展電子展廳：

深(shen)圳市同泰化學技(ji)術有限公司參加(jia)了2021年7月26-28日在廣👅州(zhōu)保利🏒世貿博覽館(guan)舉辦的第十四屆(jie)廣州國際表面處(chu)理、電鍍、塗裝展覽(lan)🚶會，誠邀您莅臨同(tóng)泰化學電子展廳(tīng)參觀指導！電♋子展(zhǎn)廳鏈接：benxiaohai.cc/news/316.html 。