Metallization for Flexible Circuits

Enabling high-density flexible boards

DuPont’s longstanding expertise in electroless copper plating is an excellent match for the demands of flexible and rigid-flex circuits built with polyimide. As more applications migrate to flexible boards, DuPont is committed to providing solutions that will enable high performance in any design configuration. Our highly conductive copper metallization is compatible with roll-to-roll processing and low-stress for long-term durability.

 

Choose DuPont as your materials solutions partner to provide:

• Cost-effective copper plating
• Balanced pH that is suitable for chemically-sensitive polyimide substrates
• Multiple plating options tailored to your specific application
• Meeting Flexible PCB Demands
   

Metallization Materials for PCBs

• Flexible Circuits
• Multi-Layered Boards
• High Density Interconnect
• IC Substrates
   

Flexible Circuits

Copper plating to meet the demands of flexible PCBs.
 

 

• Circuposit™ 200 MLB Process

A patented 3-step desmear to effectively clean, condition and activate hole-wall surfaces.

 

• Circuposit™ 4000 Horizontal Electroless Copper

A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications

 

• Conductron™ DP/DP-H Direct Plate Process

Processes especially designed for operation in vertical and horizontal equipment respectively

 

• Copper Gleam™ HGX Electrolytic Copper Plate

Producing uniform crystal grain structure to provide a smooth plated surface on rolled copper
 

• Copper Gleam™ HS-200 Electrolytic Copper

A copper plating process producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.

 

• Duraposit™ Electroless Nickel & Aurolectroless™ Immersion Gold

Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance

 

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